Suss Microtec MJB4

Precision Mask Aligner and UV Exposure System

Ideal, economical tool for laboratories and small

series production. In its contact exposure modes,

the equipment can achieve a resolution of 0.5 μm, a

performance unsurpassed in any other comparable

machine. Widely used for MEMS and optoelectronics

applications. It is specially configured for handling

nonstandard substrates such as hybrids, high frequency

components or fragile III-V materials such as GaAs

or InP. Equipped with SUSS Split field microscope

enabling fast and highly accurate alignment.

The MJB4 is equipped with a XY Theta alignment

stage using high precision, backlash-free micrometer

spindles for X, Y and Theta. The travel range for X

and Y is +/-5mm, for Theta +/-5°. Substrate thickness

compensation is easily adjustable allowing for a

shift-free separation/contact movement. The manual

Z-movement allows a maximum substrate thickness

of up to 4mm.

Features and Benefits:

Wafer and substrate handling up to dia.

100mm (wafers), 4” x 4” (substrates).

High precision X, Y, Theta alignment

stage and microscope manipulator.

Ergonomic operation. Touch panel

graphical user interface.